WS Foil is the copper foil for the high density high multilayer
wiring board, developed by the superior electrolytic technology
and treating technology of Furukawa Circuit Foil Co., Ltd.
Characteristic
Owing to even and minute treatment particles formed
on the flat matte side same as on the rolled copper
foil, superior fine pattern properties (high etching
factor and linearity of circuit) and stable insulation
between layers are obtainable and impedance control
is easy.
Owing to the treatment of a shape even, minute and
high in anchoring effect the same level of adhesion
as in the usual foil is obtainable and adhesion to
the highly heat-resistant resinbase (BT, PPE etc.)
is superior.
Mechanical properties are equal to those of our
MP Foil, and tensile strength and elongation correspond
to those of the grade 3 of IPC Standard.
The superior fine pattern properties also fit uses
for FPC (2 layers, 3 layers, multilayers etc.) and
TAB (μ BGA, CSP etc.).
In order to meet various uses 4 treatments of different
surface roughness are assorted.
