General copper foil
corresponding to grade 1 of IPC-4562.
MP
Our typical regular foil with medium profile.
Corresponding to grade 2or3 of IPC-4562.
Most in use for multilayer board in Japan.
WS
Copper foil with flat double sides which upsets usual
common sense concerning electrodeposited copper foil.
This foil has low profile optimum to use for super fine
pattern, package, TAB(μ-BGA) or 2-layer FPC and is evaluated
as the world standard.
Treatment
Singe-side -treatmemt
FO
F1
F2
F3
Exclusive treatment
for WS type.
Extremely minute particle formed on flat matte side,
treatment good for superfine patternㆍpackageㆍTAB(μ-BGA)
and two layer FPC.
According to different profile, four varieties are optional
(about 1.5μ of F0~about 3μ of F3)
GTS
Our typical treatment to cope with all prepregs such
as FR-4ㆍFR-5ㆍ
CEM-3ㆍ polymide etc.
In conbination with MP type, widely used in Japan for
inner material of mutilayer board.
Pink-colored treatment.
GY
Equivalent property to GTS, grey-colored treatment.
Our standard treatment for export widely used in the U.S.A
and Asia.
Double-side treatment (Black treatment on S-side is omissible)
GLD
Surface treatment with
GTS treatment given to both side. 2 types of 12μㆍ18μ
enabling PCB to become smaller and lighter.
GL
Surface treatment with GTS treatment given to both sides
as GLD.
Most reliable as inner layer material for high multilayer
board in combination with MP type.
Only 35μ and 70μ thicknesses are available.
