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● DOUBLETHIN Foil (to meet super
fine pattern) F-DP
Usual type of DOUBLETHIN Foil (ultra-thin foil with
carrier) has been manufactured for than 10 years already.
New type of DOUBLETHIN Foil is ultra-thin with surface roughness
and elongation at equivalent level to those of F2-WS Foil, being
developed with smaller surface roughness and improved elongation
of usual type in order to enable super fine circuit.
Stable peeling of carrier is possible after pressing epoxy base
material and coating epoxy resin (at 170℃ approximately).
Characteristics
- 5/35μ DOUBLETHIN
| |
carrier
foil |
surface
to form 5μ |
carrier
peel strength |
M-side
roughness |
FR-4
peel strength |
| as received |
after HCI-treatment |
loss |
| (kN/m) |
Ra
(㎛) |
Rz
(㎛) |
(kN/m) |
(kN/m) |
(%) |
5/35μ DOUBLETHIN-S2
(to meet super fine pattern)
F-DP5/35 |
standard
foil |
S-side |
0.03 |
0.4 |
3.1 |
1.38 |
1.38 |
0.0 |
5/35μ DOUBLETHIN-S
(usual foil) |
standard
foil |
S-side |
0.07 |
0.9 |
5.8 |
1.72 |
1.65 |
4.1 |
- 3/35μ DOUBLETHIN
| |
carrier
foil |
surface
to form 3μ |
carrier
peel strength |
M-side
roughness |
FR-4
peel strength |
| as received |
after HCI-treatment |
loss |
| (kN/m) |
Ra
(㎛) |
Rz
(㎛) |
(kN/m) |
(kN/m) |
(%) |
3/35μ DOUBLETHIN-S2
(to meet super fine pattern)
F-DP3/35 |
standard
foil |
S-side |
0.04 |
0.4 |
3.1 |
1.32 |
1.30 |
1.5 |
3/35μ DOUBLETHIN-S
(usual foil) |
standard
foil |
S-side |
0.06 |
0.7 |
4.8 |
1.35 |
1.32 |
2.2 |
* carrier peel strength : after pressing FR-4 base at
170℃
* FR-4 peel strength, as received : after pressing
at 170℃, 35㎛ plating, then measured
● DOUBLETHIN Peelable at High
Temperature (to meet polyimide) F-NP
Stable carrier peeling is possible after pressing
polyimide base and coating polyimide resin (at 300℃)
● DOUBLETHIN for Direct Laser
Drilling F-CP
Direct laser drilling is possible without
a conformal mask or a laser sheet, as treatment superior in
absorbing laser is applied on S-side.
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